RECOM’s latest innovation increases the power density of DOSA-packaged DC/DC converters to a new level.
The RPM power modules are successfully designed, tested, and manufactured – all in Europe! They are SMD with a land-grid-array package, and with input and output capacitors already included, the RPM series operates without the need for additional components.
The RPM modules stand out due to their exceptional efficiency of up to 99%, enabling a low-profile package to fit perfectly in applications where space is critical. These modules offer one of the highest power densities in a DOSA footprint on the market with a profile of only 3.75mm. They provide 1, 2, 3, or even 6A in the same-sized package for scalability.
The 6A module has at least 50% higher power density than its peers on the market, all thanks to the new IC and a novel multilayered PCB layout. It is thermally optimized to channel the heat away from the board - so without derating, it delivers over 800W/in³ at up to 90°C. With a ground plane in the PCB together with the metal housing, the 6-sided shielding guarantees great EMC performance.
RPM dimensions in millimeters
|Datasheet||Part number||Power (W)||Vin||Vout (VDC)||Iout (mA)||Outputs||Case||Isolation (kV)||Cont. SCP|
|RPM3.3-1.0||3.3||3-17 VDC||3.3||1000||1||25 pad LGA||-||yes|
|RPM5.0-1.0||5||3-17 VDC||5.0||1000||1||25 pad LGA||-||yes|
|RPM3.3-2.0||6.6||3-17 VDC||3.3||2000||1||25 pad LGA||-||yes|
|RPM3.3-3.0||9.9||3-17 VDC||3.3||3000||1||25 pad LGA||-||yes|
|RPM5.0-2.0||10||3-17 VDC||5.0||2000||1||25 pad LGA||-||yes|
|RBB10-2.0||10||2.3-5.5 VDC||05||2000-4000||1||25 pad LGA||-||yes|
|RPM5.0-3.0||15||3-17 VDC||5.0||3000||1||25 pad LGA||-||yes|
|RPM3.3-6.0||19.8||4-15 VDC||3.3||6000||1||25 pad LGA||-||yes|
|RPM5.0-6.0||30||4-15 VDC||5.0||6000||1||25 pad LGA||-||yes|
RECOM also developed evaluation boards so that customers are able to test the RPM modules quickly and easily.